DSA00170467.pdf

Partial File Text A Novel Flip Chip Bonding Technology using Au Stud Bump and Lead-free Solder Yoshihiro Yoneda1 , Toshiyuki Kuramochi1 , Tsuyoshi Sohara1 and Jae-Min Liao2 1 Fujitsu Media Devices, Ltd. Kawasaki, J
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

DSA00170467.pdf preview

Download Datasheet

User Tagged Keywords

corrosion inhibitor cte table flip chip substrate Low viscosity underfill epoxy underfill Vickers

Price & Stock Powered by