DSARS009966.pdf by Amkor Technology

Partial File Text LAMINATE data sheet Super FC® Features: Super FC® Packages: Amkor's SuperFC® is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to subst
Datasheet Type Original
RoHS Unknown
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1292 BGA amkor amkor flip flip chip bga 0,8 mm Flip Chip Substrate FOOTPRINTS USE BY AMKOR

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