DSARS009971.pdf by Amkor Technology

Partial File Text LEADFRAME data sheet TSOP Features: Thin Small Outline Package (TSOP): Amkor offers a family of popular TSOPpackages to serve the needs of ICdesigners, PCB/system engineers and componen
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jedec ms-024 marking code 56l MO-142 MO-183 MS-024 TSOP 32 thermal resistance TSOP 48 package tray TSOP 48 stacked die package TSOP 48 thermal resistance