DSASW00135393.pdf

Partial File Text PROCESS CP309 Power Transistor NPN - Low Saturation Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 41.3 x 41.3 MILS Die Thickness 9.0 MILS Base Bondin
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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CMPT3090L CMXT3090L CP309 CXT3090L CZT3090L

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