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    DSA001428.pdf by Altera

    • ® Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 · package options · pin compatibility Advanced · design flexibility Packaging Solutions F
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    "device package guide" 100 PIN PQFP ALTERA DIMENSION 15 ball CSP 192-Pin 2030 ic 5 pins 208-Pin PQFP 225-pin BGA 256 PIN QFP ALTERA DIMENSION 256-pin BGA 44-pin plcc pcb mount footprint 84 pin plcc ic base 84 PLCC pin configuration altera flex10k AW 55 IC BF 494 C bga 0,8 mm BGA 686 footprint bga 84 BGA and QFP Package BGA Package 170 epc1213 EPF10K10A EPF10K200E EPF10K30A EPF6010A EPF6016A EPF6016A PINS INFORMATION EPF6024A epm7064 epm7064 cross reference EPM7128A epm7192 EPM7256A EPM7512AE epm9320 EPM9560 pinout FLEX10K footprint pga 208 Mitsui PIN CONFIGURATION BF 494 PIN CONFIGURATION IC 555 PLCC pin configuration plcc-32 PQFP ALTERA 160 PQFP die size TQFP 100 PACKAGE footprint TQFP 144 PACKAGE footprint
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