DSA2H003458.pdf by Aries Electronics

Partial File Text High-Frequency Center ProbeTM Test Socket for Devices up to 13mm Square FEATURES ·For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices ·Any pitch device on 0.30mm pitch o
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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