DSA0025542.pdf by Intersil

Partial File Text Hermetic Packages for Integrated Circuits Ceramic Dual-In-Line Metal Seal Packages (SBDIP) D24.3 MIL-STD-1835 CDIP4-T24 (D-9, CONFIGURATION C) LEAD FINISH c1 -A- 24 LEAD CERAMIC DUAL-IN-LI
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CDIP4-T24 MARK S2