DSA0027344.pdf by Intersil

Partial File Text Thermal Characterization of Packaged Semiconductor Devices ® Technical Brief December 2002 TB379.3 Author: Jim Benson Introduction With the continuing industry trends towards smaller
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EMISSIVITY JC JB jt JEP-140 JEP140 jesd51 6 JESD51-1 JESD51-10 JESD51-11 JESD51-3 JESD51-5 JESD51-7 JESD51-9 JESD51-X PCB 1.2mm FR4 1oz cu pcb board 0.035mm TB379 thermocouple copper