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    DSA2H0050989.pdf by Foxconn

    • SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05"] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Forc
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