DSASW006898.pdf by Philips Semiconductors

Partial File Text INTEGRATED CIRCUITS SL1 ICS30 01 Bumped I·CODE1 Label IC (IC with Bumps) Chip Specification Product Specification Revision 2.2 Public Philips Semiconductors January 2005 1 Chip Spe
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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