High Frequency GHz Sockets; Max Pincount: 256; Top Pitch (mm): 1; IC Array X: 16; IC Array Y: 16; Socket Lid: Screws; Cavity Down: yes; IC Top Surface: Flat; Heat Sink: yes; Backing Plate: no; IC Total Height Max (mm): 2.5; IC Size X (mm): 17; IC Size Y (mm): 17; IC Size Tolerance (mm): 0.2; IC Ball Coplanarity (mm): 0.2; IC Ball Height Min (mm): 0.3; IC Ball Height Max (mm): 0.5; IC Ball Diameter Max (mm): 0.6; Max Package Code: BGA256; Part Description: GHz BGA Socket (ZIF)
