High Density GHz BGA Sockets; Max Pincount: 140; Top Pitch (mm): 0.4; IC Array X: 14; IC Array Y: 10; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 2.5; IC Size X (mm): 8; IC Size Y (mm): 6; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.08; IC Ball Height Min (mm): 0.15; IC Ball Height Max (mm): 0.25; IC Ball Diameter Max (mm): 0.3; Max Package Code: BGA140; Part Description: GHz BGA Socket (ZIF)-Epoxy
