SG-BGA-7072 datasheet by Ironwood Electronics
- High Density GHz BGA Sockets; Max Pincount: 327; Top Pitch (mm): 0.5; IC Array X: 19; IC Array Y: 23; Socket Lid: no; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: yes; IC Total Height Max (mm): 1.32; IC Size X (mm): 10; IC Size Y (mm): 17; IC Size Tolerance (mm): 0.1; IC Ball Coplanarity (mm): 0.1; IC Ball Height Min (mm): 0.17; IC Ball Height Max (mm): 0.27; IC Ball Diameter Max (mm): 0.35; Max Package Code: BGA627; Part Description: GHz BGA Socket (ZIF)-HD
- Original
- Unknown
- Unknown
- Unknown
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