GHz BGA Sockets-0.8mm; IC Size X (mm): 10; IC Size Y (mm): 10; IC Array X: 12; IC Array Y: 12; Max Pincount: 144; Top Pitch (mm): 0.8; IC Ball Coplanarity (mm): 0.08; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.45; IC Ball Height Min (mm): 0.25; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 1.2; Max Package Code: BGA121D; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flip Chip; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
