SG-BGA-6009 datasheet by Ironwood Electronics
- GHz BGA Sockets-1.0mm; IC Size X (mm): 27; IC Size Y (mm): 27; IC Array X: 26; IC Array Y: 26; Max Pincount: 676; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.6; IC Ball Height Min (mm): 0.4; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.5; Max Package Code: BGA676C; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: ZIF (screw); Part Description: GHz BGA Socket (ZIF)
- Original
- Unknown
- Unknown
- Unknown
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