Socket For Burn-In and Test Applications; Max Pincount: 399; Top Pitch (mm): 0.8; IC Array X: 20; IC Array Y: 20; Socket Lid: Swivel; Cavity Down: no; IC Top Surface: Flat; Heat Sink: no; Backing Plate: included; IC Total Height Max (mm): 1.7; IC Size X (mm): 17; IC Size Y (mm): 17; IC Size Tolerance (mm): 0.15; IC Ball Coplanarity (mm): 0.12; IC Ball Height Min (mm): 0.25; IC Ball Height Max (mm): 0.35; IC Ball Diameter Max (mm): 0.45; Max Package Code: Part Description: Stamped pin Burn-in socket
