DSA00166305.pdf
by Analog Devices
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Materials Declaration
Package
Body Size
LeadCount
Option
SOIC
300 mils
18
Pb Free
Molding Compound
% of Compound
Weight (g)
10
3.54 E-02
85
3.01 E-01
3
1.06 E-02
1.5
5.31 E-03
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Original
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Unknown
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Unknown
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Unknown
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