DSA0051334.pdf by OKI Electric Industry

Partial File Text This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapte
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bga 208 PACKAGE G43-87 QFJ32-P-R450-1 QFP160-P-2828-0 QFP208-P-2828-0 QFP304 SDIP64-P-750-1 SOJ28-P-400-1 TSOP 48 thermal resistance TSOP 48 thermal resistance junction to case TSOP 66 Package thermal resistance TSOP 66 pin Package thermal resistance