DSA0057089.pdf by Philips Semiconductors

Partial File Text PDF: 2000 Feb 02 Philips Semiconductors Package outline HBCC32: plastic, heatsink bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm SOT560-1 x B D b1 w M w M ball A1
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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