DSAZSAA00011562.pdf by NXP Semiconductors

Partial File Text Reflow soldering footprint Footprint information for reflow soldering of DFN1010B-6 package SOT1216 0.9 0.35 0.35 0.15 0.2 (6x) 0.15 0.35 0.5 1.2 0.6 0.35 1.3 0.25
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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