DSAZSAA00011565.pdf by NXP Semiconductors
- Reflow soldering footprint Footprint information for reflow soldering of DPAK (SOT428) package SOT428 7 6.15 5.9 5.8 1.8 1 4.725 4.6 5.75 5.65 6.5 1.15 3.6 6 2.45 6
- Original
- Unknown
- Unknown
- Unknown
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