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DSASW00291471.pdf
by National Semiconductor
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National Semiconductor Application Note 2029 Martin Schnepf June 18, 2010 Introduction inside the package can create excessive internal pressure resulting in delamination or even cracked pac
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Drypacked Devices
ipc-JEDEC J-STD-033
J-STD-020D
J-STD-033
JEDEC J-STD-033b
JEDEC J-STD-033b.1
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