DSADIGA000208953.pdf by Laird Technologies

Partial File Text TflexTM SF600 DF Series Thermal Gap Filler Innovative Technology for a Connected World COMPLIANT SILICONE-FREE 2.8-3.0 W/mK THERMALLY CONDUCTIVE GAP FILLER Tflexâ¢ SF600 DF is a high perf
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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