DSASW00303170.pdf by Novacap

Partial File Text Ceramic Surface Mount Mounting Pad Dimensions and Considerations The objective of this document is to introduce the IPC-SM-782 methodology for solder reflow land patterns. The methodology will be
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0402 capacitor ipc-SM-782 0603 footprint IPC 1206 footprint IPC 1825 footprint dimension 2211 size footprint 2225 capacitor footprint dimension 3530 novacap ceramic capacitor footprint 0402 dimension ipc-SM-782 IPC-SM-782 0805