DSASW00306418.pdf by NXP Semiconductors

Partial File Text NXP SOD882D package with strong, visible side pads First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry's first to offer s
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown

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BAS16LD dfn1006 DFN1006H4-2L LLP1006-2L PESD5V0S1BLD Slp1006P2 SOD882 SOD882D

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