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DSASW00306418.pdf
by NXP Semiconductors
Partial File Text
NXP SOD882D package with strong, visible side pads First leadless package with tin-plated, solderable side pads This new, ultra-small leadless plastic package is the industry's first to offer s
Datasheet Type
Original
RoHS
Yes
Pb Free
Yes
Lifecycle
Transferred
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DSASW00306418.pdf
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BAS16LD
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SOD882
SOD882D