The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAFRAZ0012223.pdf
Manufacturer
Linear Technology
Partial File Text
Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModuleTM solu
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSAFRAZ0012223.pdf preview
Download Datasheet
User Tagged Keywords
IPC-7525
IPC-7527
IPC7525 for lga
koki solder paste
LGA 32 land pattern
LGA land pattern
LGA voiding
LTM46
LTM4600
reflow profile FOR LGA COMPONENTS
Solder Paste, Indium 5.1 AT
Price & Stock Powered by
Findchips