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    DSAZSAA00016845.pdf

    • NXP Semiconductors
    • Package outline DIP18: plastic dual in-line package; 18 leads (300 mil); slim corner leads SOT102-2 ME seating plane D A2 A A1 L e Z b1 b 10 18 c w M (e
    • Original

    DSAZSAA00016845.pdf preview Download Datasheet

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