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    DSAZSAA00016848.pdf

    • NXP Semiconductors
    • Package outline DIP18: plastic dual in-line package; 18 leads (300 mil); long body SOT102-4 ME seating plane D A2 A A1 L e Z c w M b1 (e 1) b MH 10
    • Original

    DSAZSAA00016848.pdf preview Download Datasheet

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