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    DSAZSAA00017536.pdf

    • NXP Semiconductors
    • Package outline HBGA736: plastic thermal enhanced ball grid array package; 736 balls; heatsink SOT1035-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e
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    DSAZSAA00017536.pdf preview Download Datasheet

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