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    DSASW00313486.pdf

    • ON Semiconductor
    • MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WDFN6 2x2, 0.65P CASE 506AN-01 ISSUE E DATE 20 AUG 2010 SCALE 4:1 A B EXPOSED Cu ÇÇ ÇÇ ÉÉ PLATING 0.10 C 0.10 C L TOP VIEW
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