DSASW00313498.pdf by ON Semiconductor

Partial File Text MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DFN8 3x3, 0.5P CASE 506BJ-01 ISSUE O 1 SCALE 2:1 DATE 08 NOV 2007 2X 0.10 C 2X 0.10 C 0.05 C NOTES: 1. DIMENSIONS AND TOLERANCING
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506BJ DFN8 3X3 microdot Application Note

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