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DSASW00313605.pdf
Manufacturer
ON Semiconductor
Partial File Text
MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS WLCSP8, 1.43x1.41 CASE 567BE-01 ISSUE O SCALE 4:1 D A B PIN A1 REFERENCE 0.05 C 2X ÈÈ 2X 0.05 C DATE 26 JUL 2010 NOTES
Datasheet Type
Original
ECAD Model
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wlcsp8 footprint
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