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    DSAZSAA00018836.pdf

    • NXP Semiconductors
    • Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1
    • Original
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