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    DSAZSAA00018905.pdf

    • NXP Semiconductors
    • Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT1135A D A F D1 U1 B q C c 1 H p U2 E1 w1 3 E B A A 2 b w2 C
    • Original
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    DSAZSAA00018905.pdf preview Download Datasheet

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