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    DSAZSAA00019004.pdf by NXP Semiconductors

    • Package outline Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT443A D A F 3 D1 U1 B q C c 1 L U2 E1 A w1 M A M B M p L E 2
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    DSAZSAA00019004.pdf preview

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