DSAZSAA00019020.pdf by NXP Semiconductors

Partial File Text Package outline HLQFP100: plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; exposed die pad SOT470-2 exposed die pad c y X Dh 25 A
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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