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    DSAZSAA00019050.pdf

    • NXP Semiconductors
    • Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink SOT513-1 c y heatsink side X Dh A 60 41 61 40 ZE e
    • Original
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    DSAZSAA00019050.pdf preview Download Datasheet

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