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    DSAZSAA00019076.pdf by NXP Semiconductors

    • Package outline Leadless surface-mounted package; plastic cap; 16 terminations e1 L1 (4×) L (12×) e1 b (12×) 1 2 3 Z6 (12×) L3 (4×) 5 e2 e b2 (2×) Z4 (12×
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