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    DSAZSAA00019654.pdf by NXP Semiconductors

    • Package outline Plastic surface-mounted package; reverse pinning; 4 leads D SOT143R B E A X y HE v M A e bp w M B 3 4 Q A A1 2 c 1 Lp b1 e1
    • Original
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    DSAZSAA00019654.pdf preview

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