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    DSAZSAA00019798.pdf by NXP Semiconductors

    • Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm B D SOT631-4 A ball A1 index area E A A2 A1 detail X e1
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    DSAZSAA00019798.pdf preview

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