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    DSAZSAA00019819.pdf by NXP Semiconductors

    • Package outline HVQFN20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm A B D SOT662-1 terminal 1 index area A E A1 c
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    DSAZSAA00019819.pdf preview

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