DSAZSAA00019832.pdf
- NXP Semiconductors
- Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm D SOT746-1 A B ball A1 index area E A A2 A1 detail X C e1
- Original
-
Price & Stock Powered by
Findchips
