DSAZSAA00019848.pdf
- NXP Semiconductors
- Package outline DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A E A1 c
- Original
-
Price & Stock Powered by
Findchips
