DSAZSAA00019858.pdf by NXP Semiconductors
- Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm D SOT778-3 A B terminal 1 index area E A A1 c det
- Original
- Unknown
- Unknown
- Unknown
-
Powered by
Findchips
