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    DSAZSAA00019860.pdf by NXP Semiconductors

    • Package outline HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm SOT778-5 B D A D1 terminal 1 index area E1 E A4
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    DSAZSAA00019860.pdf preview

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