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    DSAZSAA00019871.pdf by NXP Semiconductors

    • Package outline Leadless surface-mounted package; plastic cap; 18 terminations ZD2 (10×) e3 (2×) ZE2 (12×) e4 (2×) 1 e (2×) 2 e1 (2×) e2 (2×) 3 4 ZD1 (10×
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