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    DSAZSAA00019878.pdf

    • NXP Semiconductors
    • Package outline TFBGA160: plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm A B D SOT802-2 ball A1 index area E A A2 A1 detail X e1 C
    • Original

    DSAZSAA00019878.pdf preview Download Datasheet

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