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DSAZSAA00019878.pdf
Manufacturer
NXP Semiconductors
Partial File Text
Package outline TFBGA160: plastic thin fine-pitch ball grid array package; 160 balls; body 9 x 13 x 0.7 mm A B D SOT802-2 ball A1 index area E A A2 A1 detail X e1 C
Datasheet Type
Original
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