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    DSAZSAA00019892.pdf

    • NXP Semiconductors
    • Package outline HVQFN72: plastic thermal enhanced very thin quad flat package; no leads; 72 terminals; body 10 x 10 x 0.85 mm B D SOT813-5 A terminal 1 index area A E A1 c d
    • Original

    DSAZSAA00019892.pdf preview Download Datasheet

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