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    DSAZSAA00019897.pdf by NXP Semiconductors

    • Package outline LFBGA228: plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm D B SOT821-1 A ball A1 index area A E A2 A1 detail X
    • Original
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    DSAZSAA00019897.pdf preview

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